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RH150

主營(yíng)生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料:銅箔基板,提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。

所屬分類:

產(chǎn)品關(guān)鍵詞:

手機(jī)

電子產(chǎn)品

筆記本電腦

關(guān)鍵詞:

普通FR-4 | 半固化片 | 無(wú)鉛兼容FR-4 | 無(wú)鹵兼容FR-4

產(chǎn)品描述

電子資訊工業(yè)近幾年來(lái)在中國(guó)的迅速發(fā)展下,結(jié)合各種相關(guān)產(chǎn)業(yè),已經(jīng)成為中國(guó)蓬勃發(fā)展、舉足輕重的新興產(chǎn)業(yè)。
江蘇諾德正是藉此信息產(chǎn)業(yè)化發(fā)展之平臺(tái),以專業(yè)制造電子基礎(chǔ)材料為優(yōu)勢(shì),于2007年開始建立銅箔基板生產(chǎn)基地,憑借優(yōu)秀的科技人才與創(chuàng)新的研發(fā)能力,配套發(fā)展生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料:銅箔基板,提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。

nuode

RH150

 

(UL ANSI:FR-4.1)High Performance,Mid-Tg Halogen-free

 

特點(diǎn)            

  1. 不含鹵素、砷、紅磷等成份
  2. 優(yōu)良的機(jī)械加工性能和熱性能,適用于無(wú)鉛工藝

應(yīng)用領(lǐng)域            
手機(jī)、便攜式電子產(chǎn)品、筆記本電腦、檢測(cè)設(shè)備、通信、網(wǎng)絡(luò)設(shè)備

 

 FEATURES     

  1. Free of constituents such as halogen,animony,red phosphorous,ect。
  2. Excellent mechanical processibility and thermal resistance,lead free process compliancy。

 APPLICATIONS     
Mobile phone,portable electronics,notebook and PC, QA equipment, communications,network equipment

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

 

IBS/IN

 

 

As received

A

≥8.0

10.8

After thermal stress

A

≥8.0

10.8

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥107

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

≥103

≥107

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.15

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

43

6. Flexural strength ,Minimum

 

Mpa

 

 

Length direction

A

≥415

580

Cross direction

A

≥345

460

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

160

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

 

≤5.4

4.8

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.011

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

 

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

≥150

152

13.CTE(Z-axis)

Before Tg

PPM/℃

≤60

45

After Tg

PPM/℃

≤300

240

50-260℃

%

≤3.5

2.9

14.T260

TMA

min

≥30

60

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                               Warpage of                                                                               Warpage of

                              (No-treating)                                                                               (After treating:125℃ 2hr)

 nuode               nuode

                         Peel strength

          nuode

  ※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)    

※ Other sheet size and thickness could be available upon request.

 

合作意向表

Cooperation Intent Form


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